SB 332 bismaleimide resin is designed for the production of polymer composite parts using vacuum infusion and RTM methods. This resin ensures the production of polymer composite parts with exceptionally high mechanical properties at temperatures up to 230°C, and these mechanical properties are maintained up to 250°C, allowing short-term operation of the parts at temperatures up to 250°C.
Recommended processing conditions
Assemble the vacuum bag. The residual pressure in the bag should be no more than 10 mbar. Assemble the second vacuum bag, placing sacrificial fabric or drainage material between the layers of vacuum film. Conduct a leak test on the second vacuum bag. The residual pressure in the bag should be no more than 10 mbar.
Heat the equipment to 120-130 °C*.
Degas for 10-30 minutes at a pressure no greater than 10 mbar and a temperature of 110-125°C. During degassing, the resin should be vigorously stirred; for this purpose, use special devices with automatic stirring and heating.
Maintain temperature at 120-130°C; Recommended impregnation temperature is 120°C.
Maintaining the temperature of the equipment at 120-130 °C, begin the impregnation process.
After the package is completely impregnated, close the resin inlets.
Close the exits from the inner package.
After the bag is completely soaked, increase the temperature at a rate of 2°C/min to 160°C. Maintain at 160°C for 3 hours*; heat to 180-190°C at a rate of 2°C/min; Maintain at 180-190°C for 3 hours
Before removing the product, cool the tooling to at least 90 °C at a rate of no more than 5 °C/min.
Post-curing of the product can be carried out without tooling; heating at 2°C/min up to 180°C; heating no faster than 0.2°C/min* up to 230°C; holding at 230°C for 300 min; cooling no faster than 5°C/min up to 25°C. To achieve heat resistance up to 250°C, additional post-curing at 250°C for 240 min is required. Heating from 230°C to 250°C, heating 2°C/min.
Storage conditions
The shelf life at room temperature is at least 30 days. At -18°C, it is at least 1 year.
