Epoxy glue AT-44M

Tensile strength at 25°C, MPa

45
Tensile modulus of elasticity at 25°C, GPa

4.8
Compressive strength, MPa

77
Bending strength, MPa

97
Bending modulus, GPa

4.7
T hole, °C

25℃ (24h)/65℃ (2h)
Operating temperature, °C

85
Viscosity

22
Shear strength, MPa

37

from 7 600 ₽/kg

excluding VAT

from 9 272 ₽/kg

with 22% VAT

Minimum order quantity -

5 kg.

Not a public offer

AT-44M is a two-component, thixotropic, room-temperature-curing epoxy adhesive with excellent adhesion to metallic and non-metallic materials. It is suitable for bonding metals, alloys, and polymer composite materials, as well as for gap filling and sealing, including as a liquid gasket.

AT-44M glue is supplied as a set (A+B)

Component A

buckets 3/5 l.
Component B

jars 0.5 / 3 l.
Set 5 kg

4.5 kg A + 0.5 kg B
Set 20 kg

4x4.5 kg A + 2.0 kg B

Applies:

from 7 600 ₽/kg

excluding VAT

from 9 272 ₽/kg

with 22% VAT

Minimum order quantity -

5 kg.

Not a public offer

Other cold curing epoxy adhesives

T hole, °C:
25℃ (24 hours)/65℃ (2 hours)
Operating temperature, °C:
180/250 кратк.
Viscosity:
22
Shear strength, MPa:
30

T hole, °C:
25℃ (24 h)/65℃ (2 h)
Operating temperature, °C:
180/250 кратк.
Viscosity:
1.5
Shear strength, MPa:
39

T hole, °C:
25℃ (4 ч)/65℃ (1 ч)
Operating temperature, °C:
85
Viscosity:
940 Па*с - тиксотропный
Shear strength, MPa:
25

Made in Russia

Our goal is to provide our customers with world-class materials and technical support.

phone

+7 (495) 133-26-78

for product purchasing inquiries

sales@itecma.ru

vacancies

hr@itecma.ru

For inquiries regarding the manufacturing of PCM products and tooling, please send an email

info@cspekt.ru

production and warehouse

Podolsk, Zavodskaya St., Building 2

head office

Moscow, Ramensky Boulevard, Building 1

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Tensile strength at 25°C, MPa	GOST 56800	45
Tensile modulus of elasticity at 25°C, GPa	GOST 56800	4.8
Compressive strength, MPa	GOST R 4651	77
Bending strength, MPa	GOST R 56810	97
Bending modulus, GPa	GOST R 56810	4.7
Shore hardness, method D	GOST 24621	81
Density of cured binder	GOST 15139	1.589
Glass transition temperature Tg in dry state, °C	GOST R 55135	58
CLTE (30-50°C), 10-6 1/K	GOST R 32618.2	66

Epoxy glue AT-44M

Key Features

Scope of application