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Film adhesive KPB-250

Summary

KPB-250 is a one-component bismaleimide film adhesive for bonding metallic and nonmetallic parts with operating temperature up to 250 °C.

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Description
Specifications
Application area
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Description

KPB-250 is a one-component bismaleimide film adhesive for bonding metallic and nonmetallic parts. It is also suitable for bonding honeycomb structures with wrapping. The curing temperature of the adhesive is 180 °C, post-curing temperature is 230 °C. The operating temperature of the wares reaches 250 °C.

Advantages:

  • High strength and rigidity.
  • Good stickiness.
  • Glass transition temperature is 266 °C.

Application area:

  • Metallic and non metallic constructions bonding.
  • Bonding the honeycomb constructions operated at temperatures up to 250 °C.

Specifications

Shear strength of adhesive joints of D16AT alloy at 25 °С, MPa, not less   25,1
Shear strength of adhesive joints of D16AT alloy at 200 °С, MPa, not less   13,6
Shear strength of adhesive joints of D16AT alloy at 250 °С, MPa, not less   15,4
Tensile strength at cleavage from aluminum honeycomb core, thickness 3 mm at 25 °C, MPa   3,1
Tensile strength at cleavage from GRP honeycomb core, thickness 5 mm at 25 °C, MPa   2,8

 

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